Analytical Stress Analysis in Single-lap Adhesive Joints under Buckling

Adhesive joints find numerous applications in various industrial fields. They represent a valid alternative to traditional joining methods. Much of the available scientific literature has focused on study adhesive subjected tensile loads. There have also been studies concerning stresses distributions layer. However, real case applications, could be subject cyclic tensile-compression loads and therefore buckling phenomena. The objective present paper is investigate numerical stress distribution layer under condition. presented develops with analysis single-lap joint combination steel adherends three different structural adhesives thickness Young’s modulus. are modeled using FE ANSYS©19 software. Through analyzes, it possible predict value critical load for each single analyzed combination. Once determined, middle plane determined. results obtained show that small thicknesses (i.e. 0.30 mm) reduce peaks - same by low elastic modulus (e.g. silicones).